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  the mark shows major revised points. the revised points can be easily searched by copying an "" in the pdf file and spec ifying it in the "find what:" field. preliminary data sheet nesg3033m14 npn sige rf transistor for low noise, high-gain amplification 4-pin lead-less minimold (m14, 1208 pkg) features ? the nesg3033m14 is an ideal choice fo r low noise, high-gain amplification nf = 0.6 db typ. @ v ce = 2 v, i c = 6 ma, f = 2.0 ghz ? maximum stable power gain: msg = 20.5 db typ. @ v ce = 2 v, i c = 15 ma, f = 2.0 ghz ? sige hbt technology (uhs3) adopted: f max = 110 ghz ? this product is improvem ent of esd of nesg3032m14. ? 4-pin lead-less minimold (m14, 1208 pkg) ordering information part number order number package quantity supplying form nesg3033m14 nesg3033m14-a 50 pcs (non reel) nesg3033m14-t3 nesg3033m14-t3-a 4-pin lead-less minimold (m14, 1208 pkg) (pb-free) 10 kpcs/reel ? 8 mm wide embossed taping ? pin 1 (collector), pin 4 (nc) face the perforation side of the tape remark to order evaluation samples, please contact your nearby sales office. unit sample quantity is 50 pcs. absolute maximum ratings (t a = +25 c) parameter symbol ratings unit collector to base voltage v cbo note 1 5.0 v collector to emitter voltage v ceo 4.3 v base current i b note 1 12 ma collector current i c 35 ma total power dissipation p tot note 2 150 mw junction temperature t j 150 c storage temperature t stg ? 65 to +150 c notes 1. v cbo and i b are limited by the permissible cu rrent of the protection element. 2. mounted on 1.08 cm 2 1.0 mm (t) glass epoxy pwb caution observe precautions when handling because these devic es are sensitive to el ectrostatic discharge. r09ds0049ej0300 rev.3.00 sep 14, 2012 r09ds0049ej0300 rev.3.00 page 1 of 14 sep 14, 2012
recommended operating range (t a = +25 c) parameter symbol min. typ. max. unit input power p in ? ? 0 dbm base feedback resister r b ? ? 100 k remark when the voltage return bias circuit like the figure below is used, a current increase is seen because the esd protection element is turned on when recommended range of motion in the above table is exceeded. however, there is no influence of reliability, including deterioration. r b bias choke nesg3033m14 r09ds0049ej0300 rev.3.00 page 2 of 14 sep 14, 2012
electrical characteristics (t a = +25 c) parameter symbol test conditions min. typ. max. unit dc characteristics collector cut-off current i cbo v cb = 5 v, i e = 0 ? ? 100 na emitter cut-off current i ebo v eb = 1 v, i c = 0 ? ? 100 na dc current gain h fe note 1 v ce = 2 v, i c = 6 ma 220 300 380 ? rf characteristics insertion power gain ? s 21e ? 2 v ce = 2 v, i c = 15 ma, f = 2.0 ghz 15.0 17.5 ? db noise figure nf v ce = 2 v, i c = 6 ma, f = 2.0 ghz, z s = z sopt , z l = z lopt ? 0.60 0.85 db associated gain g a v ce = 2 v, i c = 6 ma, f = 2.0 ghz, z s = z sopt , z l = z lopt ? 17.5 ? db reverse transfer capacitance c re note 2 v cb = 2 v, i e = 0, f = 1 mhz ? 0.15 0.25 pf maximum stable power gain msg note 3 v ce = 2 v, i c = 15 ma, f = 2.0 ghz 17.5 20.5 ? db gain 1 db compression output power p o (1 db) v ce = 3 v, i c (set) = 20 ma, f = 2.0 ghz, z s = z sopt , z l = z lopt ? 12.5 ? dbm 3rd order intermodulation distortion output intercept point oip 3 v ce = 3 v, i c (set) = 20 ma, f = 2.0 ghz, z s = z sopt , z l = z lopt ? 24.0 ? dbm notes 1. pulse measurement: pw 350 s, duty cycle 2% 2. collector to base capacit ance when the emitter grounded 3. msg = h fe classification rank fb/yfb marking zl h fe value 220 to 380 s 21 s 12 nesg3033m14 r09ds0049ej0300 rev.3.00 page 3 of 14 sep 14, 2012
typical characteristics (t a = +25 c, unless otherwise specified) 250 200 150 100 50 0 25 50 75 100 125 150 f = 1 mhz 0.3 0.2 0.1 012345 v ce = 1 v 100 10 1 0.01 0.001 0.1 0.0001 0.7 0.5 0.6 0.4 0.8 0.9 1.0 v ce = 3 v 100 10 1 0.01 0.001 0.1 0.0001 0.7 0.5 0.6 0.4 0.8 0.9 1.0 v ce = 2 v 100 10 1 0.01 0.001 0.1 0.0001 0.7 0.5 0.6 0.4 0.8 0.9 1.0 35 i b = 20 a 120 a 200 a 140 a 160 a 180 a 80 a 60 a 40 a 100 a 40 20 25 30 15 5 10 012345 mounted on glass epoxy pcb (1.08 cm 2 1.0 mm (t) ) total power dissipation p tot (mw) ambient temperature t a (?c) total power dissipation vs. ambient temperature reverse transfer capacitance c re (pf) collector to base voltage v cb (v) reverse transfer capacitance vs. collector to base voltage collector current i c (ma) base to emitter voltage v be (v) collector current vs. base to emitter voltage collector current i c (ma) base to emitter voltage v be (v) collector current vs. base to emitter voltage collector current i c (ma) base to emitter voltage v be (v) base to emitter voltage collector current vs. collector current i c (ma) collector to emitter voltage v ce (v) collector current vs. collector to emitter voltage remark the graphs indicate nominal characteristics. nesg3033m14 r09ds0049ej0300 rev.3.00 page 4 of 14 sep 14, 2012
1 000 100 10 1 0.1 10 100 v ce = 1 v 1 000 100 10 1 0.1 10 100 v ce = 3 v 1 000 100 10 1 0.1 10 100 v ce = 2 v dc current gain h fe collector current i c (ma) dc current gain vs. collector current dc current gain h fe collector current i c (ma) dc current gain vs. collector current dc current gain h fe collector current i c (ma) dc current gain vs. collector current remark the graphs indicate nominal characteristics. nesg3033m14 r09ds0049ej0300 rev.3.00 page 5 of 14 sep 14, 2012
v ce = 3 v f = 2 ghz 30 5 10 15 20 25 0 10 1 100 v ce = 1 v i c = 15 ma 40 35 30 25 20 15 10 5 0 0.1 1 10 100 mag msg |s 21e | 2 v ce = 3 v i c = 15 ma 40 35 30 25 20 15 10 5 0 0.1 1 10 100 mag msg |s 21e | 2 v ce = 2 v i c = 15 ma 40 35 30 25 20 15 10 5 0 0.1 1 10 100 mag msg |s 21e | 2 msg mag msg mag msg mag gain bandwidth product f t (ghz) collector current i c (ma) gain bandwidth product vs. collector current gain bandwidth product f t (ghz) collector current i c (ma) gain bandwidth product vs. collector current gain bandwidth product f t (ghz) collector current i c (ma) gain bandwidth product vs. collector current frequency f (ghz) insertion power gain, mag, msg vs. frequency insertion power gain |s 21e | 2 (db) maximum available power gain mag (db) maximum stable power gain msg (db) frequency f (ghz) insertion power gain, mag, msg vs. frequency insertion power gain |s 21e | 2 (db) maximum available power gain mag (db) maximum stable power gain msg (db) frequency f (ghz) insertion power gain, mag, msg vs. frequency insertion power gain |s 21e | 2 (db) maximum available power gain mag (db) maximum stable power gain msg (db) v ce = 1 v f = 2 ghz 30 5 10 15 20 25 0 10 1 100 v ce = 2 v f = 2 ghz 30 5 10 15 20 25 0 10 1 100 remark the graphs indicate nominal characteristics. nesg3033m14 r09ds0049ej0300 rev.3.00 page 6 of 14 sep 14, 2012
v ce = 1 v f = 3 ghz |s 21e | 2 30 25 20 15 10 5 0 1 10 100 mag msg collector current i c (ma) insertion power gain, msg vs. collector current insertion power gain |s 21e | 2 (db) collector current i c (ma) collector current i c (ma) insertion power gain, mag vs. collector current insertion power gain |s 21e | 2 (db) maximum available power gain mag (db) collector current i c (ma) insertion power gain, mag, msg vs. collector current insertion power gain |s 21e | 2 (db) maximum available power gain mag (db) maximum stable power gain msg (db) collector current i c (ma) maximum stable power gain msg (db) insertion power gain |s 21e | 2 (db) maximum available power gain mag (db) maximum stable power gain msg (db) insertion power gain, mag, msg vs. collector current insertion power gain |s 21e | 2 (db) maximum available power gain mag (db) maximum stable power gain msg (db) insertion power gain, mag, msg vs. collector current collector current i c (ma) insertion power gain, msg vs. collector current insertion power gain |s 21e | 2 (db) maximum stable power gain msg (db) v ce = 1 v f = 0.5 ghz msg |s 21e | 2 30 25 20 15 10 5 0 1 10 100 v ce = 1 v f = 2 ghz mag msg |s 21e | 2 30 25 20 15 10 5 0 1 10 100 v ce = 1 v f = 1 ghz mag msg |s 21e | 2 30 25 20 15 10 5 0 1 10 100 v ce = 2 v f = 0.5 ghz msg |s 21e | 2 30 25 20 15 10 5 0 1 10 100 v ce = 1 v f = 5 ghz 25 20 15 10 5 0 ? 1 10 100 mag |s 21e | 2 remark the graphs indicate nominal characteristics. nesg3033m14 r09ds0049ej0300 rev.3.00 page 7 of 14 sep 14, 2012
v ce = 3 v f = 0.5 ghz msg |s 21e | 2 30 25 20 15 10 5 0 1 10 100 collector current i c (ma) insertion power gain, msg vs. collector current insertion power gain |s 21e | 2 (db) maximum stable power gain msg (db) collector current i c (ma) insertion power gain, msg vs. collector current insertion power gain |s 21e | 2 (db) maximum stable power gain msg (db) collector current i c (ma) insertion power gain, mag vs. collector current insertion power gain |s 21e | 2 (db) maximum available power gain mag (db) collector current i c (ma) insertion power gain, mag, msg vs. collector current insertion power gain |s 21e | 2 (db) maximum available power gain mag (db) maximum stable power gain msg (db) collector current i c (ma) insertion power gain, mag, msg vs. collector current insertion power gain |s 21e | 2 (db) maximum available power gain mag (db) maximum stable power gain msg (db) collector current i c (ma) insertion power gain, msg vs. collector current insertion power gain |s 21e | 2 (db) maximum stable power gain msg (db) v ce = 2 v f = 1 ghz msg |s 21e | 2 30 25 20 15 10 5 0 1 10 100 v ce = 3 v f = 1 ghz |s 21e | 2 msg 30 25 20 15 10 5 0 1 10 100 v ce = 2 v f = 5 ghz mag |s 21e | 2 30 25 20 15 10 5 0 1 10 100 v ce = 2 v f = 2 ghz |s 21e | 2 30 25 20 15 10 5 0 1 10 100 mag msg v ce = 2 v f = 3 ghz |s 21e | 2 30 25 20 15 10 5 0 1 10 100 mag msg remark the graphs indicate nominal characteristics. nesg3033m14 r09ds0049ej0300 rev.3.00 page 8 of 14 sep 14, 2012
collector current i c (ma) insertion power gain, mag, msg vs. collector current insertion power gain |s 21e | 2 (db) maximum available power gain mag (db) maximum stable power gain msg (db) collector current i c (ma) insertion power gain, mag, msg vs. collector current insertion power gain |s 21e | 2 (db) maximum available power gain mag (db) maximum stable power gain msg (db) collector current i c (ma) insertion power gain, mag vs. collector current insertion power gain |s 21e | 2 (db) maximum available power gain mag (db) v ce = 3 v f = 3 ghz |s 21e | 2 30 25 20 15 10 5 0 1 10 100 mag msg v ce = 3 v f = 5 ghz |s 21e | 2 30 25 20 15 10 5 0 1 10 100 mag v ce = 3 v f = 2 ghz |s 21e | 2 30 25 20 15 10 5 0 1 10 100 mag msg remark the graphs indicate nominal characteristics. nesg3033m14 r09ds0049ej0300 rev.3.00 page 9 of 14 sep 14, 2012
20 15 10 5 0 ? 50 40 10 20 30 0 ?0 ?0 ? 0 ?5 5 p out i c v ce = 3 v, f = 2 ghz i cq = 20 ma (rf off) input power p in (dbm) output power, collector current vs. input power output power p out (dbm) collector current i c (ma) measuring method : measured at power matched with exte rnal sleeve tuner. (the load resistance is not inserted between the base dc power supply and bias tee.) collector current i c (ma) noise figure, associated gain vs. collector current noise figure nf (db) associated gain g a (db) 4 2 1 3 0 20 5 10 15 0 1 10 100 v ce = 2 v f = 2 ghz g a nf remark the graphs indicate nominal characteristics. s-parameters s-parameters and noise parameters are provided on our web site in a form (s2p) that enables direct import of the parameters to microwave circuit simulators without the need for keyboard inputs. click here to download s-parameters. [products] [rf devices] [device parameters] url http://www.renesas.com/products/microwave/ nesg3033m14 r09ds0049ej0300 rev.3.00 page 10 of 14 sep 14, 2012
evaluation circuit example (f = 1.575 ghz lna) c1 c3 r1 l1 r3 c4 r2 l2 c2 tr. (nesg3033m14) gnd v cc nesg3033m14 gps_lna in notes 1. 15 24 mm, t = 0.2 mm double sided copper clad glass epoxy pwb. 2. au plated on pattern 3. : through holes nesg3033m14 r09ds0049ej0300 rev.3.00 page 11 of 14 sep 14, 2012
evaluation circuit (f = 1.575 ghz lna) in c3 l1 out c2 v cc l2 c4 c1 r1 10 000 pf 5.6 nh 82 k 10 000 pf r3 3.9 nh r2 62 5.6 3 v 10 000 pf 6 pf microstrip w = 0.15 mm l = 0.5 mm 2 the application circuits and their parameters are for reference only and are not intended for use in actual design-ins. component list symbol parts part number maker value c1, c3, c4 chip capacitor grm155b31h103ka88 murata 10 000 pf c2 chip capacitor grm1552c1h6r0dz01 murata 6 pf l1 chip inductor aml1005h5n6sts fdk 5.6 nh l2 chip inductor aml1005h3n9sts fdk 3.9 nh r1 chip resistor mcr01mzpj823 rohm 82 k r2 chip resistor MCR01MZPJ5R6 rohm 5.6 r3 chip resistor mcr01mzpj620 rohm 62 nesg3033m14 r09ds0049ej0300 rev.3.00 page 12 of 14 sep 14, 2012
example of characteristics for 1.575 ghz lna evaluation board electrical characteristics (t a = +25 c, v cc = 3 v, i c = 6.1 ma, f = 1.575 ghz) parameter symbol value unit noise figure nf 0.72 db gain g a 17.3 db input return loss rl in 10.3 db output return loss rl out 14.2 db gain 1 db compression output power p o (1 db) ? 0.3 dbm input 3rd order distortion interception point iip 3 0.7 dbm typical characteristics (t a = +25 c, unless otherwise specified) v cc = 3 v, f = 1.575 ghz i cq = 6.1 ma (rf off) 15 10 5 0 ? ?0 25 20 5 10 15 0 ?5 ?0 ? 0 ?5 5 p out i c ?0 note input power p in (dbm) output power, collector current vs. input power output power p out (dbm) collector current i c (ma) 40 ? 80 ? 60 ? 40 ? 20 0 20 ? 30 ? 20 ? 10 010 p out im 3 iip 3 = 0.7 dbm v cc = 3 v, i c = 6.1 ma f1in = 1.575 ghz, f2in = 1.576 ghz output power p out (dbm) 3rd order intermodulation distortion im 3 (dbm) output power, im 3 vs. input power input power p in (dbm) note a current increase is seen because the esd protection element is turned on. however, there is no influence of deterioration etc. on reliability. remark the graph indicates nominal characteristics. nesg3033m14 r09ds0049ej0300 rev.3.00 page 13 of 14 sep 14, 2012
package dimensions 4-pin lead-less minimold (m 14, 1208 pkg) (unit: mm) pin connections 1. collector 2. emitter 3. base 4. nc (connected with pin 2) note zl 0.5?.05 0.11 +0.1 ?.05 0.2 0.2 1.2 +0.07 ?.05 0.8 0.8 +0.07 ?.05 1.0?.05 0.15?.05 43 12 (bottom view) note a nc pin is non-connection in the mold package (when nc-pi n is open state, it will get an influences of floating capacitance. therefore, we recommend that nc pin connect to emitter pin). nesg3033m14 r09ds0049ej0300 rev.3.00 page 14 of 14 sep 14, 2012
revision history nesg3033m14 data sheet description rev. date page summary 1.00 jul 19, 2005 ? first edition issued 2.00 sep 11, 2007 ? second edition issued 3.00 sep 14, 2012 throughout the co mpany name is changed to renesas electronics corporation. p.1 modification of ordering information p.3 modification of electrical characteristics p.3 modification of h fe classification p.10 modification of met hod for obtaining s-parameters p.12 modification of evalution circuit p.12 modification of component list p.13 modification of example of characteristics for f = 1.575 ghz lna evaluation board p.14 modification of package dimensions all trademarks and registered tr ademarks are the property of their respective owners. c - 1
notice 1. descriptions of circuits, software and other related information in this document are provided only to illustrate the operat ion of semiconductor products and application examples. you are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. renesas electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. 2. renesas electronics has used reasonable care in preparing the information included in this document, but renesas electronics does not warrant that such information is error free. renesas electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information incl uded herein. 3. renesas electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property ri ghts of third parties by or arising from the use of renesas electronics products or technical information described in this document. no license, express, implied or otherwise, is granted hereby under any paten ts, copyrights or other intellectual property rights of renesas electronics or others. 4. you should not alter, modify, copy, or otherwise misappropriate any renesas electronics product, whether in whole or in part . renesas electronics assumes no responsibility for any losses incurred by you or third parties arising from such alteration, modification, copy or otherwise misappropriation of renesas electronics product. 5. renesas electronics products are classified according to the following two quality grades: "standard" and "high quality". t he recommended applications for each renesas electronics product depends on the product's quality grade, as indicated below. "standard": computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots etc. "high quality": transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; an ti-crime systems; and safety equipment etc. renesas electronics products are neither intended nor authorized for use in products or systems that may pose a direct threat t o human life or bodily injury (artificial life support devices or systems, surgical implantations etc.), or may cause serious property damages (nuclear reactor control systems, military equipment etc.). you mus t check the quality grade of each renesas electronics product before using it in a particular application. you may not use any renesas electronics product for any application for which it is not intended. renesas electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any renesas electronics product for which the product is not intended by renesas electronics. 6. you should use the renesas electronics products described in this document within the range specified by renesas electronics , especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. renesas e lectronics shall have no liability for malfunctions or damages arising out of the use of renesas electronics products beyond such specified ranges. 7. although renesas electronics endeavors to improve the quality and reliability of its products, semiconductor products have s pecific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. further, renesas electronics products are not subject to radiation resistance desig n. please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a renesas electronics produc t, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measu res. because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or systems manufactured by you. 8. please contact a renesas electronics sales office for details as to environmental matters such as the environmental compatib ility of each renesas electronics product. please use renesas electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, in cluding without limitation, the eu rohs directive. renesas electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. 9. renesas electronics products and technology may not be used for or incorporated into any products or systems whose manufactu re, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. you should not use renesas electronics products or technology described in this document for any purpose relating to military applications or use by the military, including but not limited to the development of weapons of mass destruction. when exporting the renesas electronics products or technology described in this do cument, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations. 10. it is the responsibility of the buyer or distributor of renesas electronics products, who distributes, disposes of, or othe rwise places the product with a third party, to notify such third party in advance of the contents and conditions set forth in this document, renesas electronics assumes no responsibility for any losses incurred by yo u or third parties as a result of unauthorized use of renesas electronics products. 11. this document may not be reproduced or duplicated in any form, in whole or in part, without prior written consent of renesa s electronics. 12. please contact a renesas electronics sales office if you have any questions regarding the information contained in this doc ument or renesas electronics products, or if you have any other inquiries. (note 1) "renesas electronics" as used in this document means renesas electronics corporation and also includes its majority-o wned subsidiaries. (note 2) "renesas electronics product(s)" means any product developed or manufactured by or for renesas electronics. htt p ://www.renesas.co m refer to "htt p ://www.renesas.com/" for the latest and detailed information . california eastern laboratories , inc. 4590 patrick henr y drive, santa clara, california 95054, u.s.a . tel: +1-408-919-2500, fax: +1-408-988-0279 renesas electronics europe limited dukes meadow, millboard road, bourne end, buckinghamshire, sl8 5fh, u.k tel: +44-1628-651-700, fax: +44-1628-651-804 renesas electronics europe gmbh arcadiastrasse 10, 40472 dsseldorf, germany tel: +49-211-65030, fax: +49-211-6503-1327 renesas electronics (china) co., ltd. 7th floor, quantum plaza, no.27 zhichunlu haidian district, beijing 100083, p.r.china tel: +86-10-8235-1155, fax: +86-10-8235-7679 renesas electronics (shanghai) co., ltd. unit 204, 205, azia center, no.1233 lujiazui ring rd., pudong district, shanghai 200120, china tel: +86-21-5877-1818, fax: +86-21-6887-7858 / -7898 renesas electronics hong kong limited unit 1601-1613, 16/f., tower 2, grand century place, 193 prince edward road west, mongkok, kowloon, hong kong tel: +852-2886-9318, fax: +852 2886-9022/9044 renesas electronics taiwan co., ltd. 13f, no. 363, fu shing north road, taipei, taiwan tel: +886-2-8175-9600, fax: +886 2-8175-9670 renesas electronics singapore pte. ltd. 80 bendemeer road, unit #06-02 hyflux innovation centre singapore 339949 tel: +65-6213-0200, fax: +65-6213-0300 renesas electronics malaysia sdn.bhd. unit 906, block b, menara amcorp, amcorp trade centre, no. 18, jln persiaran barat, 46050 petaling jaya, selangor darul ehsan, malaysia tel: +60-3-7955-9390, fax: +60-3-7955-9510 renesas electronics korea co. , ltd . 11f., samik lavied' or bld g ., 720-2 yeoksam-don g , kan g nam-ku, seoul 135-080, korea tel: +82-2-558-3737 , fax: +82-2-558-514 1 s ale s o ffi c e s ? 2012 renesas electronics corporation. all ri g hts reserved . 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